The SBL series surface-mount multi-layer chip bead is manufactured using high-quality ferrite materials and advanced multi-layer processes, specifically designed for cellular phones and mobile radios, ensuring excellent magnetic shielding, high reliability, and EMI suppression. The product features a robust and reliable structure with a closed magnetic circuit design to prevent crosstalk. It meets 20% impedance tolerance requirements. It is suitable for cellular phones, mobile radios, and wireless communication equipment. It is an ideal choice for multi-layer chip bead applications in EMI suppression and RF filtering.
| Size |
Impedance(Ohm) @100MHz |
DCR(Ohm) Max |
IDC(mA) Max |
| 1005 | 5~1200 | 0.045~1.8 | 25~500 |
| 1608 | 5~2000 | 0.05~1.2 | 50~1000 |
| 2012 | 7~3000 | 0.2~1.4 | 50~600 |
| 3216 | 19~3000 | 0.04~1.0 | 80~2000 |
| 4516 | 80~1000 | 0.01~0.15 | 1500~6000 |
| 4532 | 70-150 | 0.035~0.05 | 3000~6000 |
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Q: Do you provide technical support and selection recommendations?
A: Yes. We have a professional technical team that can provide selection recommendations and customisation solutions based on customer application scenarios and circuit requirements.
Q: Are samples free? How soon can I receive them?
A: Samples are free of charge and will be shipped within 3-5 working days. For specific shipping cost policies, please contact our sales team for confirmation.
Q: How do you handle quality issues if they occur?
A: We ensure product conformity through incoming quality inspection and 100% quality testing before shipment. If quality issues occur, please contact our sales team promptly. We will provide return/exchange or technical support solutions.