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Heat Resistance 10mH Reflow Soldering Chip Inductor

5000PCS
MOQ
Negotiation
Price
Heat Resistance 10mH Reflow Soldering Chip Inductor
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Features
Specifications
Inductance: 1uH To 10mH
Base Material: Ceramic Base
Core: Ferrite DR/RI Core
Packing: Reel
Storage Temperature: -40 To +125℃
Operating Temperature: -25℃ To+105℃
Highlight:

10mH Reflow Soldering Chip Inductor

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RI Core Chip Inductor

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Epoxy Resin Adhesive Chip Inductor

Basic Infomation
Place of Origin: China
Brand Name: Shinhom
Certification: RoHS
Model Number: SPI-0401C/0402C/0602C Series
Payment & Shipping Terms
Packaging Details: Carton
Delivery Time: 4~8 Weeks
Payment Terms: T/T
Supply Ability: 1000000/MONTH
Product Description

SMD Inductor , Low Profile , High Heat Resistance For Reflow Soldering , Ceramic Base Chip Inductor

 

Feature:

  • Low profile and shielded
  • Very effective in space-conscious applications
  • Low resistance and high energy storage
  • Excellent as DC to DC converter for notebooks, computers, PDAsand mobile phones, step-up or step-down converters, flash memoryprogrammes

 

Materials:

  • Core: ferrite DR/RI core
  • Wire: enameled copper wire
  • Adhesive: epoxy resin
  • Base: ceramic
  • Storage temperature: -40 to +125℃
  • Operating temperature: -25 to +105℃
  • Resistance to solder heat: 260℃, 10 seconds

Heat Resistance 10mH Reflow Soldering Chip Inductor 0Heat Resistance 10mH Reflow Soldering Chip Inductor 1Heat Resistance 10mH Reflow Soldering Chip Inductor 2

 

 

Note: Product specifications can be customized.

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