Magnetically Shielded SMD Chip Inductor & Ferrite Bead with 1µH–100µH Inductance for EMI/RFI Filtering

Our SMD Chip Inductors and Ferrite Beads are manufactured using multilayer ceramic technology, featuring high Q factor and excellent self-resonant frequency (SRF) characteristics. They are designed for impedance matching and resonance in high-frequency RF and IF circuits.This series covers compact package sizes from 0201 to 1206, with an inductance range from 0.047 μH to 120 μH, and supports tolerance options of ±5% and ±10%. The magnetic shielding structure effectively prevents inter-inductor coupling, making it suitable for space-constrained and performance-critical applications such as smartphones, wireless communication devices, automotive electronics, and radar systems.

• Multilayer Ceramic Technology – High precision and excellent consistency
• High Q Factor – Improved RF circuit selectivity
• High SRF – Suitable for high-frequency applications
• Compact Size Options – 0201 / 0402 / 0603 / 0805 / 1206
• Inductance Range – 0.047 μH to 120 μH
• Tolerance Options – ±0.3 nH / ±5% / ±10%
• Magnetic Shielding Structure – Eliminates cross-coupling interference
• Operating Temperature – -55°C to +125°C

• DC/DC converters
• Notebook computers
• Battery-powered equipment
• Digital cameras and scanners
• CD-ROM / DVD devices
• PDA and portable electronics

Q: What is the difference between multilayer chip inductors and wirewound chip inductors?

A:
Multilayer chip inductors are manufactured using multilayer ceramic printing technology, offering smaller size and higher consistency, making them suitable for high-density mounting and high-frequency applications. Wirewound chip inductors typically provide higher Q factor and higher current handling capability, but their size is relatively larger.

Q: What are the advantages of the magnetic shielding structure in the AIML series?

A:The magnetic shielding structure effectively suppresses electromagnetic field leakage and prevents cross-coupling between inductors. This allows multiple components to be placed closely together on a compact PCB without mutual interference, making it especially suitable for high-density RF and communication circuit designs.

Q: How do I choose the appropriate package size?

A:0201 / 0402: Ultra-compact portable devices

0603 / 0805: General-purpose applications with balanced performance and size

1206 / 1210 / 1806: Applications requiring higher current or larger inductance values