AISC Series SMD Wire Wound Ceramic Chip Inductor High Q High SRF for Wireless Communications and GPS

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AISC Series SMD Wire Wound Ceramic Chip Inductor High Q High SRF for Wireless Communications and GPS
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Features
Specifications
Working Frequency: High Frequency
Size: 0402/0603/0805/1008/1210/1812
Structure Of Magnetizer: Ceramic Or Ferrite
Inductance: Customized
Type: SMT Chip Inductor
Operating Temperature: -40℃ To +125℃
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SMD wire wound ceramic chip inductor

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high Q chip inductor for GPS

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high SRF inductor for wireless communications

Basic Infomation
Place of Origin: China
Brand Name: Shinhom
Certification: RoHS
Model Number: AISC Series
Payment & Shipping Terms
Packaging Details: Carton
Delivery Time: 4~8 Weeks
Payment Terms: T/T
Supply Ability: 1000000/MONTH
Product Description

The AISC series SMD wire-wound ceramic inductor features a high-frequency design and wire-wound structure, offering high Q factor and high self-resonant frequency characteristics, ensuring excellent signal transmission performance in high-frequency circuits. The product offers a ceramic core as standard, with ferrite core optional, suitable for different frequency and inductance requirements. High reliability and excellent thermal stability ensure long-term stable operation under various conditions. Multiple standard sizes from 0402 to 1812 are available to meet different PCB layout requirements. It is widely used in modems, mobile wireless devices, cordless phones, GPS positioning systems, and telecom systems.

Features:

  • Ceramic Core(Ferrite core optional)
  • High frequency design
  • Excellent Q values
  • Excellent SRF
  • High reliability
  • Excellent thermal stability
  • Sizes 0402/0603/0805/1008/1210/1812

Applcations:

  • Modems
  • Mobile Radios
  • Cordless Telephones
  • Global Positioning Systems
  • Telecommunications Systems

Technical information:

  • Testing: (Equivalent acceptable),lnductance: HP4191A,Q:HP4291A,SRF:HP8753B,RDC:measured @ 25℃
  • Operating Temperature: Ceramic-40℃ to +125℃
  • Pad metalization: Tungsten-nickel with gold flash
  • Solder methods: Wave, Reflow, Vapor Phase
  • Solderability: Max 260℃ for 10 seconds
Size Inductance range Size(mm)L*W*H
0402

1nH to 400nH(Ceramic Core)

1.2*0.6*0.6
0603 1.6nH to 390nH(Ceramic Core) 1.68*1.0*0.85
0805 2.2nH to 6.8uH(Ceramic Core) 2.2*1.6*1.3
1008 3.9nH to 200nH(Ceramic Core) 2.65*2.6*2.0
1210 3.9nH to 8.6uH(Ceramic Core) 3.35*2.7*2.1
1210F 1.2uH to 470uH(Ferrite core) 3.35*2.7*2.1
1812F

1.0uH to 1000uH(Ferrite core)

4.56*3.25*3.0

                              AISC Series SMD Wire Wound Ceramic Chip Inductor High Q High SRF for Wireless Communications and GPS

                        AISC Series SMD Wire Wound Ceramic Chip Inductor High Q High SRF for Wireless Communications and GPS

Notes: Product size and inductance can be customized

FAQ

Q: How to choose between ceramic core and ferrite core?

A: Ceramic cores offer higher Q factor and better high-frequency characteristics, suitable for RF and microwave bands. Ferrite cores have higher magnetic permeability, allowing larger inductance values in the same volume, suitable for lower frequency applications or applications requiring higher inductance values. Ceramic is the standard configuration, while ferrite is an optional choice.

Q: What are the benefits of high Q factor for circuit design?

A: High Q factor means lower energy loss and better frequency selectivity at specific frequencies. It improves resonant circuit gain and selectivity, reduces insertion loss, improves filter out-of-band rejection, and enhances oscillator frequency stability.

Q: What package sizes are available for this series?

A: Six standard sizes are available: 0402, 0603, 0805, 1008, 1210, and 1812. They can be flexibly selected based on PCB space and inductance requirements.

Q: What are the advantages of wire-wound structure compared to multi-layer structure?

A: Wire-wound structure offers higher Q factor and higher current capacity at high frequencies, especially suitable for high-frequency applications requiring high Q factor and high current, such as RF front-ends and power amplifiers.

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Contact Person : Jack wang
Tel : 13909218465
Fax : 86-029-87851840
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